Japan, Jan. 28 -- SAMSUNG ELECTRO-MECHANICS CO LTD has got intellectual property rights for 'LAMINATED ELECTRONIC COMPONENT.' Other related details are as follows:

Application Number: JP,2021-173139

Category (FI): H01G4/30,201@M,H01G4/30,201@N,H01G4/30,311@Z,H01G4/30,512,H01G4/30,515,H01G4/30,517

Stage: Grant (IP right document published.)

Filing Date: Oct. 22, 2021

Publication Date: July 14, 2022

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....