Japan Intellectual Property Rights: JOINED BODY OF MOSAIC DIAMOND WAFER AND HETEROGENEOUS SEMICONDUCTOR AND METHOD FOR MANUFACTURING THE SAME, AND MOSAIC DIAMOND WAFER FOR JOINED BODY WITH HETEROGENEOUS SEMICONDUCTOR

Japan, June 25 -- MITSUBISHI ELECTRIC CORP,NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY has got intellectual property rights for 'JOINED BODY OF MOSAIC DIAMOND WAFER AND HETEROGENEOUS SEMICONDUCTOR AND METHOD FOR MANUFACTURING THE SAME, AND MOSAIC DIAMOND WAFER FOR JOINED BODY WITH HETEROGENEOUS SEMICONDUCTOR.' Other related details are as follows:

Application Number: JP,2021-091708

Category (FI): H10P52/00@D,C30B33/06,C30B29/38@D,C30B29/04@A,H01L21/02@B,H01L21/304,622@W,H01L21/304,621@C,H01L21/304,621@Z,H10P52/00@W,H10P52/00@Z

Stage: Grant (IP right granted following substantive examination.)

Filing Date: May 31, 2021

Publication Date: Dec. 13, 2022

The original document can be viewed at: https://www.j-platpat.inp...