Japan, March 23 -- TOSHIBA CORP,TOSHIBA MATERIALS CO LTD has got intellectual property rights for 'INSULATION CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME.' Other related details are as follows:

Application Number: JP,2025-019055

Category (FI): H01L23/12@C,H01L23/12@D,H01L23/14@M,H05K1/02@Q,H05K1/03,610@D,H05K1/03,610@E,H10W70/00@S,H10W70/05,200,H10W70/20,H10W70/66,H10W70/68,200

Stage: Grant (IP right document published.)

Filing Date: Feb. 7, 2025

Publication Date: April 17, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....