Japan, Jan. 28 -- TOWA CORP has got intellectual property rights for 'INSPECTION DEVICE, CUTTING DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR COMPONENT.' Other related details are as follows:
Application Number: JP,2023-209387
Category (FI): H01L21/66@A,H01L21/66@J,H10P74/00@A,H10P74/20@J
Stage: Grant (IP right document published.)
Filing Date: Dec. 12, 2023
Publication Date: June 24, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....