Japan Intellectual Property Rights: HOLDING MEMBER, TRANSFER DEVICE, CUTTING TABLE, CUTTING DEVICE, SEMICONDUCTOR MANUFACTURING DEVICE, MANUFACTURING METHOD FOR HOLDING MEMBER, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

Japan, Feb. 24 -- TOWA CORP has got intellectual property rights for 'HOLDING MEMBER, TRANSFER DEVICE, CUTTING TABLE, CUTTING DEVICE, SEMICONDUCTOR MANUFACTURING DEVICE, MANUFACTURING METHOD FOR HOLDING MEMBER, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE.' Other related details are as follows:

Application Number: JP,2023-121524

Category (FI): H01L21/68@P,H10P72/78

Stage: PROBLEM TO BE SOLVED: To make it possible to easily remove a to-be-held object after suction is released without damaging a holding member's suction power.SOLUTION: A holding member 10 has suction holes 10a formed for sucking and holding a to-be-held object W. Multiple recesses 10c are formed on the surface of a holding area 10R for holding the to-be-held object W ...