Japan, Jan. 28 -- HPSP CO LTD has got intellectual property rights for 'HIGH-VOLTAGE SUBSTRATE PROCESSING DEVICE.' Other related details are as follows:
Application Number: JP,2024-216297
Category (FI): H01L21/31@B,H10P14/60,101@B
Stage: Grant (IP right document published.)
Filing Date: Dec. 11, 2024
Publication Date: June 24, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....