Japan, Jan. 28 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'GRINDING METHOD OF WAFER.' Other related details are as follows:

Application Number: JP,2022-051346

Category (FI): B24B7/04@A,H01L21/304,622@R,H01L21/304,631,H10P52/00@C,H10P52/00@U

Stage: Grant (IP right document published.)

Filing Date: March 28, 2022

Publication Date: Oct. 11, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....