Japan, Jan. 23 -- RESONAC PACKAGING CORP has got intellectual property rights for 'EXTERIOR MATERIAL FOR POWER STORAGE DEVICE.' Other related details are as follows:
Application Number: JP,2023-174035
Category (FI): H01M50/105,H01G11/78,H01M50/129,H01M50/121,H01M50/119
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Oct. 6, 2023
Publication Date: Jan. 23, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....