Japan, March 24 -- MEC CO LTD has got intellectual property rights for 'ETCHING LIQUID SET, ETCHING METHOD AND METHOD FOR FORMING SEMICONDUCTOR PATTERN.' Other related details are as follows:

Application Number: JP,2022-186436

Category (FI): C23F1/26,C23F1/28,H05K3/06@M

Stage: Grant (IP right document published.)

Filing Date: Nov. 22, 2022

Publication Date: June 3, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....