Japan, July 31 -- NAMICS CORP has got intellectual property rights for 'EPOXY RESIN COMPOSITION, FILM, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2021-135659
Category (FI): C08G59/62,C08L63/00@B,C08L29/14,C08K5/3445,H01L23/30@R,H10W74/47,C08L63/00@A,C08J5/18
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Aug. 23, 2021
Publication Date: March 8, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....