Japan, April 14 -- UBE EXSYMO CO LTD has got intellectual property rights for 'END PROCESSING DEVICE FOR HOLLOW RESIN PLATE AND DEVICE FOR MANUFACTURING HOLLOW RESIN PLATE.' Other related details are as follows:
Application Number: JP,2022-043295
Category (FI): B29C53/04
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 18, 2022
Publication Date: Sept. 29, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....