Japan, April 1 -- HONOR DEVICE CO LTD has got intellectual property rights for 'ELECTRONIC DEVICE AND CHIP PACKAGING METHOD.' Other related details are as follows:

Application Number: JP,2024-232671

Category (FI): H01L23/00@C,H01L23/30@D,H01L25/00@Z,H01L25/04@Z,H01L25/08@D,H01L25/08@H,H01Q1/52,H05K9/00@A,H10W42/20,H10W74/10@F,H10W74/15,H10W90/00,H10W90/20@H,H10W90/22

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Dec. 27, 2024

Publication Date: March 26, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....