Japan, March 27 -- FIRST SYSTEM CO LTD has got intellectual property rights for 'ELECTRONIC COMPONENT MOUNTING SUBSTRATE.' Other related details are as follows:

Application Number: JP,2022-114569

Category (FI): H01L23/12@K,H01L25/04@A,H01L33/54,H01L33/62,H01R4/70@Z,H05K1/18@Z,H05K3/28@F,H05K3/28@G,H10H20/853,H10H20/857,H10H29/24,H10H29/80,H10H29/853,H10W70/00@K,H10W90/00,700

Stage: Grant (IP right granted following substantive examination.)

Filing Date: July 19, 2022

Publication Date: Jan. 31, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....