Japan, Jan. 28 -- TDK CORP has got intellectual property rights for 'ELECTRONIC COMPONENT MANUFACTURING DEVICE AND ELECTRONIC COMPONENT MANUFACTURING METHOD.' Other related details are as follows:

Application Number: JP,2022-089811

Category (FI): B23K26/70,H01G13/00,H01G4/30,311@Z,H01G4/30,517,B23K26/142,B23K26/00@H

Stage: Grant (IP right document published.)

Filing Date: June 1, 2022

Publication Date: Dec. 13, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....