Japan, Oct. 7 -- TOKYO OHKA KOGYO CO LTD has got intellectual property rights for 'DIFFUSION AGENT COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE.' Other related details are as follows:
Application Number: JP,2022-092245
Category (FI): H01L21/225@R,H10P32/14@R
Stage: Grant (IP right granted following substantive examination.)
Filing Date: June 7, 2022
Publication Date: Dec. 19, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....