Japan, Nov. 7 -- FASFORD TECHNOLOGY CO LTD has got intellectual property rights for 'DIE BONDING DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2024-112568
Category (FI): H01L21/52@F
Stage: Grant (IP right document published.)
Filing Date: July 12, 2024
Publication Date: Oct. 1, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....