Japan Intellectual Property Rights: DICING/DIE BONDING INTEGRATED FILM AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Japan, Sept. 3 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'DICING/DIE BONDING INTEGRATED FILM AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD.' Other related details are as follows:

Application Number: JP,2022-043633

Category (FI): H10P58/00@V,C09J4/00,C09J7/30,H01L21/52@E,H01L21/78@Y,H01L21/78@V,H01L21/78@M,H10P58/00@Y,H10W72/30@E,H10P58/00@M

Stage: Grant (IP right granted following substantive examination.)

Filing Date: March 18, 2022

Publication Date: Sept. 29, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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