Japan, Sept. 7 -- MITSUBISHI ELECTRIC CORP has got intellectual property rights for 'CUTTING DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2022-184511
Category (FI): H10P58/00@F,H01L21/78@F
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Nov. 18, 2022
Publication Date: May 30, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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