Japan, Jan. 28 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'CUTTING BLADE, MANUFACTURING METHOD FOR CUTTING BLADE AND CUTTING METHOD FOR WAFER.' Other related details are as follows:
Application Number: JP,2019-166094
Category (FI): B24B27/06@M,B24D3/00,340,H10P58/00@F,H01L21/78@F,B24D5/12@Z,B24D3/04
Stage: Grant (IP right document published.)
Filing Date: Sept. 12, 2019
Publication Date: March 18, 2021
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....