Japan Intellectual Property Rights: CURABLE RESIN COMPOSITION, TEMPORARY FIXING MATERIAL AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT

Japan, Jan. 19 -- SEKISUI CHEM CO LTD has got intellectual property rights for 'CURABLE RESIN COMPOSITION, TEMPORARY FIXING MATERIAL AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT.' Other related details are as follows:

Application Number: JP,2022-196951

Category (FI): B32B27/00@D,B32B7/06,C07D207/452,C07D209/48,C07D487/04,137,C08F2/44@C,C08F283/04,C08F290/06,C08G73/10,C08G73/12,C08K3/013,C08K5/3415,C08L79/08@Z,C08L83/04,C09J11/04,C09J11/06,C09J11/08,C09J179/04@B,C09J179/08,C09J179/08@Z,C09J4/00,C09J7/30,C09J7/35,H01L21/304,622@J,H01L21/68@N,H01L21/78@M,H10P52/00@M,H10P58/00@M,H10P72/70

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Dec. 9, 2022

Publication Date: March 14, 2023

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