Japan, Jan. 28 -- FUJIFILM CORP has got intellectual property rights for 'CURABLE COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE SHEET, DEVICE WITH THERMALLY CONDUCTIVE LAYER, AND COMPOUND.' Other related details are as follows:
Application Number: JP,2021-196906
Category (FI): C08K3/013,C08K3/22,C08K3/28,C08K3/38,C08K9/04,C08K9/06,C08L101/00,C08L63/00@B
Stage: Grant (IP right document published.)
Filing Date: Dec. 3, 2021
Publication Date: June 15, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....