Japan, Sept. 3 -- MITSUBISHI MATERIALS CORP has got intellectual property rights for 'Cu PILLAR JOINT AND MANUFACTURING METHOD THEREOF.' Other related details are as follows:
Application Number: JP,2023-067191
Category (FI): H10W72/20,102@A,H01L21/92,604@A,H01L21/92,603@A,H01L21/60,311@Q,H10W72/00,101@Q,H10W72/20,101@A,H10W72/20,103@A,H01L21/92,602@D
Stage: Grant (IP right granted following substantive examination.)
Filing Date: April 17, 2023
Publication Date: Oct. 29, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....