Japan, July 31 -- DOWA METALTECH KK has got intellectual property rights for 'COPPER/CERAMIC BONDED SUBSTRATE AND PRODUCTION METHOD THEREFOR.' Other related details are as follows:
Application Number: JP,2022-039743
Category (FI): B23K35/30,310@B,H05K3/38@D,B23K35/30,310@C,C04B37/02@B,C22C9/00,C22C5/06@Z
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 14, 2022
Publication Date: Sept. 27, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....