Japan, Jan. 28 -- MITSUBISHI MATERIALS CORP has got intellectual property rights for 'COPPER/CERAMIC ASSEMBLY AND INSULATION CIRCUIT BOARD.' Other related details are as follows:
Application Number: JP,2021-070221
Category (FI): B23K1/19@B,C04B37/02@B,H01L23/12@C,H05K3/38@B,H10W70/68,200
Stage: Grant (IP right document published.)
Filing Date: April 19, 2021
Publication Date: Oct. 31, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....