Japan Intellectual Property Rights: COPPER ALLOY, COPPER ALLOY PLASTIC PROCESSING MATERIAL, PART FOR ELECTRONIC AND ELECTRICAL APPARATUSES, TERMINAL, BUS BAR, LEAD FRAME, AND HEAT DISSIPATION SUBSTRATE

Japan, Jan. 28 -- MITSUBISHI MATERIALS CORP has got intellectual property rights for 'COPPER ALLOY, COPPER ALLOY PLASTIC PROCESSING MATERIAL, PART FOR ELECTRONIC AND ELECTRICAL APPARATUSES, TERMINAL, BUS BAR, LEAD FRAME, AND HEAT DISSIPATION SUBSTRATE.' Other related details are as follows:

Application Number: JP,2021-214029

Category (FI): C22C9/00,C22F1/00,606,C22F1/00,612,C22F1/00,613,C22F1/00,623,C22F1/00,624,C22F1/00,650@A,C22F1/00,651@Z,C22F1/00,661@A,C22F1/00,681,C22F1/00,682,C22F1/00,683,C22F1/00,685@A,C22F1/00,685@Z,C22F1/00,686@A,C22F1/00,691@B,C22F1/00,691@C,C22F1/00,694@A,C22F1/00,694@B,C22F1/00,694@Z,C22F1/08@B

Stage: Grant (IP right document published.)

Filing Date: Dec. 28, 2021

Publication Date: July 10, 2023

The origin...