Japan, June 22 -- SHIN ETSU POLYMER CO LTD has got intellectual property rights for 'CONDUCTIVE COMPOSITE BODY DISPERSION, MANUFACTURING METHOD THEREFOR, AND METHOD FOR MANUFACTURING CONDUCTIVE LAMINATE.' Other related details are as follows:

Application Number: JP,2022-205557

Category (FI): C08G61/12,H01B1/12@F,C08L25/18,C08L101/12,C08L65/00

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Dec. 22, 2022

Publication Date: July 4, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....