Japan Intellectual Property Rights: COMPOSITION FOR REMOVING EDGE BEADS OF METAL-CONTAINING RESISTS OR DEVELOPER COMPOSITION FOR METAL-CONTAINING RESISTS, AND PATTERN FORMING METHOD USING THE SAME

Japan, March 27 -- SAMSUNG SDI CO LTD has got intellectual property rights for 'COMPOSITION FOR REMOVING EDGE BEADS OF METAL-CONTAINING RESISTS OR DEVELOPER COMPOSITION FOR METAL-CONTAINING RESISTS, AND PATTERN FORMING METHOD USING THE SAME.' Other related details are as follows:

Application Number: JP,2024-127677

Category (FI): G03F7/004,G03F7/004,531,G03F7/32,H01L21/30,569@E,H01L21/30,577,H10P76/00,569@E,H10P76/00,577

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Aug. 2, 2024

Publication Date: Feb. 17, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....