Japan Intellectual Property Rights: COMPOSITION FOR POLISHING, POLISHING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR SUBSTRATE

Japan, March 25 -- FUJIMI INC has got intellectual property rights for 'COMPOSITION FOR POLISHING, POLISHING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR SUBSTRATE.' Other related details are as follows:

Application Number: JP,2022-056492

Category (FI): C09G1/02,B24B37/00@H,H10P52/00@H,H10P52/40,H01L21/304,622@D,C09K3/14,550@D,C09K3/14,550@Z

Stage: Grant (IP right granted following substantive examination.)

Filing Date: March 30, 2022

Publication Date: Oct. 13, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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