Japan, Oct. 30 -- SEIKO EPSON CORP has got intellectual property rights for 'COMPONENT DISASSEMBLY DEVICE AND FOREIGN MATTER REMOVAL METHOD.' Other related details are as follows:
Application Number: JP,2021-210447
Category (FI): B65G27/04,B65G47/14,101@C,B07C5/04
Stage: Grant (IP right document published.)
Filing Date: Dec. 24, 2021
Publication Date: July 6, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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