Japan, March 24 -- TAIYO YUDEN CO LTD has got intellectual property rights for 'COIL COMPONENT, CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING COIL COMPONENT.' Other related details are as follows:

Application Number: JP,2022-023229

Category (FI): H01F27/06,103,H01F27/29,123,H01F27/29@F,H01F27/29@P,H01F41/04@B

Stage: Grant (IP right document published.)

Filing Date: Feb. 17, 2022

Publication Date: Aug. 29, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication....