Japan, Sept. 9 -- AISHIN:KK has got intellectual property rights for 'CIRCUIT BOARD SOLDERING METHOD AND CIRCUIT BOARD.' Other related details are as follows:
Application Number: JP,2022-205277
Category (FI): H05K3/34,501@A,H05K3/3494@Z,H05K3/3494@C,H05K3/34,505@B,H05K1/11@A,H05K3/34,507,H05K3/3485@A
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Dec. 22, 2022
Publication Date: July 4, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....