Japan, March 5 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'CHIP MANUFACTURING METHOD.' Other related details are as follows:
Application Number: JP,2022-019259
Category (FI): H01L21/304,601@Z,H01L21/78@F,H01L21/78@B,H01L21/78@Q,H10P52/00@R,H10P58/00@B,H10P58/00@F,H10P58/00@Q,H10P95/60@Z,H10P52/00@Y
Stage: PROBLEM TO BE SOLVED: To provide a chip manufacturing method with which it is possible to prevent breakage of a device when removing a ring-shaped reinforcement part and improve the productivity of chips manufactured from a wafer.SOLUTION: Prior to a removal step in which a ring-shaped reinforcement part is removed, a singulation step for singulating a plurality of devices and manufacturing chips is carried out....