Japan, June 10 -- DENKA CO LTD has got intellectual property rights for 'CHIP, METHOD FOR PRODUCING CHIP, AND ADHESIVE COMPOSITION.' Other related details are as follows:
Application Number: JP,2025-029879
Category (FI): C09J11/04,C08L11/00,B29B9/02,C09J111/00,C08F136/18,C08J3/16,C08J3/12@Z
Stage: Grant (IP right document published.)
Filing Date: Feb. 27, 2025
Publication Date: Aug. 1, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....