Japan, Oct. 30 -- NIKON CORP has got intellectual property rights for 'BONDING METHOD AND BONDING DEVICE.' Other related details are as follows:
Application Number: JP,2024-016719
Category (FI): H01L21/68@F,H01L21/02@B,H01L21/68@K
Stage: Grant (IP right document published.)
Filing Date: Feb. 6, 2024
Publication Date: April 16, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
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