Japan, Feb. 24 -- LAM RESEARCH CORPORATION has got intellectual property rights for 'ATOMIC LAYER ETCHING SYSTEM FOR SELECTIVELY ETCHING WITH HALOGEN-BASED COMPOUND.' Other related details are as follows:
Application Number: JP,2024-067862
Category (FI): H01L21/268@J,H01L21/26@J,H10P34/00@J,H10P50/24,H10P50/26,H10P50/28,H01L21/302,101@G,H10P50/20,105@A,H10P50/20,101@G,H10P50/20,101@C,H10P34/42@J,H01L21/302,101@C,H01L21/302,105@A
Stage: PROBLEM TO BE SOLVED: To provide a substrate processing system.SOLUTION: A substrate processing system 100 includes a processing chamber 108, a substrate support 110, a heat source 126, a gas delivery system 160 and a controller 180. The substrate support is disposed in the processing chamber and supports ...