Japan, July 14 -- IBIDEN CO LTD has got intellectual property rights for 'AQUEOUS SOLUTION FOR ELECTROPLATING PRETREATMENT.' Other related details are as follows:
Application Number: JP,2022-090275
Category (FI): H05K3/18@G,C25D5/34
Stage: PROBLEM TO BE SOLVED: To provide an aqueous solution for electroplating pretreatment and an electroplating pretreatment method for improving connectivity between a chemical copper substrate and an electroplating copper layer.SOLUTION: An aqueous solution for electroplating pretreatment contains the same pretreatment component as a smoothing treatment component composed of halogen ions and/or a nonionic surfactant in an electroplating solution in a subsequent step. The concentration of the pretreatment ...