Japan, Nov. 12 -- APIC YAMADA CORP has got intellectual property rights for 'APPARATUS AND METHOD FOR FORMING SEALING RESIN USED IN COMPRESSION MOLDING.' Other related details are as follows:
Application Number: JP,2023-050313
Category (FI): H01L21/56@R,H10W74/01@R,B29B9/08,B29C33/12,B29C43/36
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 27, 2023
Publication Date: Oct. 9, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....