Japan Intellectual Property Rights: ADHESIVE SHEET FOR WORKPIECE PROCESSING AND SEMICONDUCTOR DEVICE

Japan, May 13 -- LINTEC CORP has got intellectual property rights for 'ADHESIVE SHEET FOR WORKPIECE PROCESSING AND SEMICONDUCTOR DEVICE.' Other related details are as follows:

Application Number: JP,2022-039267

Category (FI): H10P58/00@M,H10P52/00@M,H01L21/304,622@J,H01L21/78@M,C09J11/00,B32B27/30@A,C09J201/00,C09J7/40,B32B27/00@M,C09J133/04,C09J7/38

Stage: Grant (IP right granted following substantive examination.)

Filing Date: March 14, 2022

Publication Date: Sept. 27, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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