Japan, March 27 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'ADHESIVE FILM FOR SEMICONDUCTOR, DICING DIE BONDING FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2023-152168
Category (FI): C09J11/04,C09J11/06,C09J163/00,C09J7/30,H01L21/52@E,H10W72/30@E
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Sept. 20, 2023
Publication Date: Nov. 24, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....