Japan, Jan. 28 -- DIC CORP has got intellectual property rights for 'ADHESIVE COMPOSITION AND MOLDED ARTICLE.' Other related details are as follows:
Application Number: JP,2021-122318
Category (FI): C09J133/04
Stage: Grant (IP right document published.)
Filing Date: July 27, 2021
Publication Date: Feb. 8, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication....