Japan Intellectual Property Rights: 5-MEMBERED FUSED-RING COMPOUND AND METHOD FOR PRODUCING THE SAME, CURABLE COMPOSITION, CURED PRODUCT, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, SEMICONDUCTOR SEALANT AND SEMICONDUCTOR DEVICE

Japan, March 25 -- DIC CORP has got intellectual property rights for '5-MEMBERED FUSED-RING COMPOUND AND METHOD FOR PRODUCING THE SAME, CURABLE COMPOSITION, CURED PRODUCT, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, SEMICONDUCTOR SEALANT AND SEMICONDUCTOR DEVICE.' Other related details are as follows:

Application Number: JP,2022-005983

Category (FI): C08L87/00,C08L65/00,C08G61/00,H10W74/47,H01L23/30@R,C08J5/24,C08G85/00

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Jan. 18, 2022

Publication Date: July 28, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

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