India, Nov. 4 -- The Government of India has issued a release:
A new silicon chip that allows terahertz waves to pass through an engineered barrier with little loss, while carrying data at 100 Gbit/s, points to compact terahertz circuits for future 6G communication technologies.
Future sixth-generation (6G) wireless networks are expected to use terahertz frequencies, which lie between microwaves and infrared light and offer wide bandwidth. Guiding these waves through compact circuits is challenging, as bends, junctions and abrupt changes in a waveguide can scatter or reflect part of the signal, weakening it as it travels.
By arranging triangular holes in a carefully designed pattern in a silicon slab, researchers can create a photonic cr...