Intellectual Property India Publishes Patent Application for Workpiece Having A Hard Material Layer

MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202617072679 A) filed by Voestalpine Eifeler Vacotec Gmbh on June 11, 2026, for Workpiece Having A Hard Material Layer.

Inventors include Evertz, Simon; Zimmermann, Uwe; and Holzapfel, Damian.

The application for the patent was published on September 18, 2026, under issue no. 38/2026.

Abstract: A workpiece includes a substrate and a hard material layer disposed over the substrate. The hard material layer comprises at least one first metal nitride layer and at least one second metal nitride layer disposed one over the other. The first metal nitride layer has a composition (Tia,Sib,Zz)CpN1-p with optionally added alloying elements Z = (Ni,Ta,Mo,W,Nb,...