Intellectual Property India Publishes Patent Application for Thermoplastic Vulcanizate Polymeric Materials For High-Voltage Housings

MUMBAI, India, Sept. 14 -- Intellectual Property India has published a patent application (202617064440 A) filed by Aclara Technologies LLC on May 21, 2026, for Thermoplastic Vulcanizate Polymeric Materials For High-Voltage Housings.

Inventor includes Masghouni, Nejib.

The application for the patent was published on September 11, 2026, under issue no. 37/2026.

Abstract: Disclosed herein are high-voltage assemblies that take advantage of a thermoplastic vulcanizate to improve performance and ease of manufacture. An example high- voltage assembly includes a component capable of operating in a high-voltage environment, and a thermoplastic vulcanizate housing that encloses the component. Also disclosed herein are methods of making the thermo...