MUMBAI, India, Sept. 14 -- Intellectual Property India has published a patent application (202617069655 A) filed by Momentive Performance Materials Inc. on June 03, 2026, for Thermally Conductive Composition.
Inventors include Kondo, Takuya; Takahashi, Hideo; Hoshino, Chisato; Perala, Suresh Kumar; Naik, Sandeep; Dalavoy, Tulika; Dolai, Sukanta; Dutta, Pranabesh; Prasad, Manish Chand; and Lee, Nicholas.
The application for the patent was published on September 11, 2026, under issue no. 37/2026.
Abstract: Provided is a composition containing (A) an organopolysiloxane and (B) a thermal conductivity improver. The thermal conductivity improver includes: a first thermal conductivity improver having a particle size in the range of 60 to about ...