MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202648109288 A) filed by Qualcomm Incorporated on September 11, 2026, for Thermal Mitigation For Usb Power Delivery.
Inventors include Mishra, Lalan Jee; Wietfeldt, Richard Dominic; Panian, James Lionel; and Paparrizos, Georgios Konstantinos.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: Thermal mitigation features may be included in a Universal Serial Bus (USB) cable assembly or in the USB receptacle portion of a device. In one aspect, one or both ends of a USB cable jacket may have greater thermal conductivity than the portion between them. The portion having the greater thermal conductivit...