MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202647101975 A) filed by Borgwarner Inc. on August 24, 2026, for Thermal Energy Transfer Assembly And Method Of Making The Same.
Inventor includes O'Connor, Kurt F..
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: A thermal energy transfer assembly includes a substrate made of a first material which has a first thermal conductivity coefficient, the substrate having a first surface and a second surface which is opposed to the first surface. The thermal energy transfer assembly also includes a thermal energy transfer element made of a second material having a second thermal conductivity coefficie...