MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202614015281 A) filed by Tanigurogumi Corporation on February 11, 2026, for Substrate Having Fine Through-Holes Filled With Metal And Manufacturing Method Thereof.
Inventor includes Watanabe, Genzo -.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: A substrate having a plurality of fine through-holes filled with metal, comprising a conductive layer formed on an inner wall surface of each through- hole and a metal solder layer formed by solidification of a nickel-containing molten solder that has been treated with an organic fatty acid-containing solution. The conductive layer includes a copper plat...