Intellectual Property India Publishes Patent Application for Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, On-Vehicle Electronic Circuit, Ecu Electronic Circuit, On-Vehicle Electronic Circuit Device, And Ecu Electronic Circuit Device

MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617094241 A) filed by Senju Metal Industry Co. , Ltd. on August 04, 2026, for Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, On-Vehicle Electronic Circuit, Ecu Electronic Circuit, On-Vehicle Electronic Circuit Device, And Ecu Electronic Circuit Device.

Inventors include Iijima Yuki; and Yokoyama Takahiro.

The application for the patent was published on October 30, 2026, under issue no. 44/2026.

Abstract: The present invention provides a solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, an on-vehicle electronic circuit, an ECU electronic circuit, an on-vehicle electronic circuit device, and an EC...