MUMBAI, India, Sept. 14 -- Intellectual Property India has published a patent application (202611087154 A) filed by Uttaranchal University on July 16, 2026, for Smart Circular Material Credit System.
Inventors include Siddharth Swami; Nishtha Dhiman; Dharam Buddhi; Shalini Goyal Bhalla; and Manmohan Singh Rawat.
The application for the patent was published on September 11, 2026, under issue no. 37/2026.
Abstract: A smart circular material credit system (SCMCS) utilizes a distributed digital and physical architecture to quantify, validate, and monetize circular economy practices in real time. The system is structured with an input layer comprising IoT-enabled sensors, industrial data streams, and material tracking inputs to monitor materi...